马立新一作论文发表于 Applied Thermal Engineering，祝贺！
Lixin Ma's first-author paper published in Applied Thermal Engineering — congratulations!
课题组论文《Dynamic thermal management for chip cooling energy reduction: an intelligent power modulation framework using multi-level load decomposition and optimization》在 Applied Thermal Engineering 正式发表（307, 133353, 2026）。
论文提出了基于多级负载分解与优化的智能功率调控框架，面向芯片散热显著降低冷却能耗。本工作是与马浩课题组李宇成同学合作完成的。
祝贺马立新（第一作者）！
Our paper "Dynamic thermal management for chip cooling energy reduction: an intelligent power modulation framework using multi-level load decomposition and optimization" has been published in Applied Thermal Engineering (307, 133353, 2026).
The paper proposes an intelligent power-modulation framework based on multi-level load decomposition and optimization, significantly reducing chip-cooling energy consumption. This work was done in collaboration with Yucheng Li from Prof. Hao Ma's group.
Congratulations to Lixin Ma (first author)!